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Wednesday, August 17, 2016

Mitsubishi Electric to Discharge Institutionalized HVIGBT Module X-Series

Mitsubishi Electric Corporation declared today that it has built up a cutting edge power module called X-Series New Dual HVIGBT module for footing and electric force applications in overwhelming commercial ventures. The new module highlights higher force thickness and proficiency for inverters and in addition an institutionalized bundle that considers an adaptable configuration of inverter frameworks.

Tests of the 3.3kV (LV100) variant of the New Dual module will be accessible for transportation from March 2017. That will be trailed by 1.7kV, 3.3kV (HV100), 4.5kV and 6.5kV variants in a specific order from 2018 onwards. The organization additionally plans to add a lower-than 1.7kV rendition to the lineup later on.

High-control modules are key gadgets for controlling force transformation in electronic frameworks in an extensive variety of force classes from a few kilowatts up to a few megawatts. Up to this point, modules with the greatest voltage rating of up to 6.5kV and a most extreme current rating of a few thousand amperes have been monetarily accessible.

The New Dual HVIGBT module will fulfill interest for productive, high power thickness semiconductor gadgets with a scope of current and voltage evaluations, while adding to higher force yield and proficiency in inverters by embracing the most recent seventh-era IGBTs and RFC diodes. Then, the institutionalized bundle measurements will permit makers of mechanical gadgets to disentangle plan and secure numerous hotspots for inverters.

Item Features:

1. Contributing to high vitality effectiveness and high power thickness •The seventh-era IGBTs receiving CSTBTTM and RFC diodes acknowledge low power misfortune in inverter frameworks.

• Improved bundle innovation and low parasitic inductance empower the greatest execution.

• Three AC fundamental terminals on the LV100 bundle spread and even out current thickness, adding to expanded inverter capacity.

2. Common edge size backings more various inverter setups and limit •LV100 and HV100 modules have a typical bundle plan.

• Simple, standard associations take into consideration ideal framework outline and a scope of current evaluations.

• Lineup ranges from 1.7 to 6.5kV.

• Improved adaptability and versatility for framework design.

3. Contributing to higher configuration productivity by the utilization of an institutionalized new bundle

• Compatible with terminal and connection areas of Infineon Technologies AG (Germany) items.

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