Mitsubishi developed the X
series of dual IGBT modules, samples of a 3.3. kv ( LV100 with 6KV
isolation taking up to a 450A) will be available for shipping from March
next year (2017), then 1.7 kb, 3.3 kv, 4.5 and 6.5kv versions in that order,
they will be all available from 2019 onwards (with a 10kv isolation)
This device will satisfy demand
for efficient and high power density semiconductors, they will be contributing
to higher power outputs and efficiency by adopting the lastest diodes for IGBTs
and RFCs, standardized 100x140x40 package dimensions will allow the manufacturing
industry to simplify the design and secure multiple sources for inverters.
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