Infineon launchs new 600 V Performance IGBT

Infineon Technologies has dispatched the new 600 V TRENCHSTOP Performance IGBT. The new discrete IGBT is intended to give high vitality productivity and dependability at a focused value point for applications like aerating and cooling, sun based PV inverters, drives and uninterruptible force supply (UPS). In light of Infineon's TRENCHSTOP innovation, the new IGBT is improved for hard exchanging topologies working at frequencies of up to 30 kHz. The new TRENCHSTOP Performance IGBT arrangement joins the best exchange off amongst conduction and switch-off vitality misfortunes with extraordinary heartiness, 5 µsec hamper and astounding electromagnetic obstruction (EMI) conduct.

Simple overhaul – next level productivity

The 600 V TRENCHSTOP Performance is an alluring contrasting option to the forerunner TRENCHSTOP IGBT from Infineon and additionally to contending items. In an attachment and-play substitution the new TRENCHSTOP Performance IGBT yields lessened misfortunes of 7 percent at exchanging recurrence of 8 kHz. An unmatched 11 percent lower complete misfortune is conveyed for exchanging recurrence of 15 kHz. Making utilization of the same bundles, overhauls for higher proficiency and aggressive expense can be acknowledged effectively, quick and with low endeavors. The 600 V TRENCHSTOP Performance IGBT adds to more vitality proficient force utilization, higher unwavering quality and more operational lifetime of the application. For end purchasers this interprets into a lower power bill, supportability and ecological security.

Accessibility

The TRENCHSTOP Performance IGBT is accessible at this point.

IGBT’s Contribution to a Better Performance

When needed the IGBT is ideally suited for cost sensitive but high reliable, solar and resonant inverters, motor control applications, UPS, SMPS, portable inverters, generators, welding equipment, high power electric tools, and applications in the transportation markets, where weight reduction is needed, such as automotive, airplanes and aerospace systems.

-Reliability engineering and system safety

-Highest technology and quality that innovates

-Advanced and cost- effective reference solutions and design support

-Wide portfolio of components tailored for every need

-System expertise and a top performance

By contributing all this we guarantee  expertise and system understanding will meet your requirements as a  customer.

Thermal Behavior of Paralleling IGBTS

Using multiple smaller chips instead of one larger chip improves the thermal behavior, as they doesn`t heat as quickly as a larger one, they tend to devides the heating properties well, This is due to the fact that not only the chip itself, but also a certain area around the chip, will participate in the transfer of heat from the chip to the heatsink. Parallelling systems have improved thermal spreading when using two small chips instead of one large, with in equal total area in both cases.

This case can also be seen when comparing the thermal resistance of the 100 A IGBT in the P569-F module with the 35 A IGBT in the P700-F module. The thermal resistance junction to heatsink for the 100 A the device is 0,57 K/W. The resistance for the single 35 A IGBT is 1,29 K/W, resulting in an  resistance of 0,43 K/W, when 3 of them are used in parallel. This provides an improvement of about 25 % in thermal performance,one point for these kind of system, that left behind the more traditional one-module igbt old system, this also compensates for some if not all of the de-rating required due to the non-ideal current sharing.