Picking the right IGBT for the proper
application is not a little assignment – there are a wide range of setups from
various semiconductor producers. Fuji Electric's first mass-delivered module
was a 2-in-1 Buck-Boost for a major Japanese automaker. From that point
forward, the organization has experienced various emphases, and presently has a
few standard offerings of auto evaluation modules, including 6-in-1 bundles
appraised for 650 V, 400 A and 600 A
With each one passing model year, the
prerequisites requested of car force hardware increment. Business strengths are
pushing Insulated Gate Bipolar Transistor (IGBT) modules towards lighter,
littler, all the more compelling and more dependable engineering. These
exchanging gadgets are what power an EV or half breed inverter, and with
progressively stringent emanations necessities, automakers are searching for
more creative answers for force their next charged items.
"We have yet to see the brilliant age of
the electric auto," Nitesh Satheesh, Semiconductor Application Engineer at
Fuji Electric, told Charged. "At the same time that day is not very far
away and we are get ready to serve it."
Fuji Electric, initially settled in 1923,
started mass-creating auto IGBT modules in 2005. The organization ceaselessly
strives to attain to a zero-deformity future and, to that end, is always
executing new mixes of configuration and procedure control procedures,
consolidated with screening and centered unwavering quality building.
In 2008 Fuji Electric released New Fuji IGBT
Module for High-capacity Industrial Equipment, a new product has been added to
the line-up using FDT’s fifth generation IGBT, U4 series.
In 2010 Fuji Electric released New Fuji
High-Power 2-in-1 IGBT Module Series Designed for Parallel Connections.
In 2011 Fuji Electric released New New V-Series
Intelligent Power Modules Fuji IGBT Equipped with 6th-Generation IGBT Chips and
Capable of the Highest Efficiency in the Industry.
In 2011 Fuji Electric released New Fuji IGBT
Module for Advanced Neutral Point Clamped (NPC) Circuits Series World’s First
Module with a 3-Level Platform in a Single Package.
In 2012 Fuji Electric announced it has
developed EasyPIMTM insulated gate bipolar transistor (Fuji IGBT) modules
fitted with 6th-generation IGBT chips and plans to commence a sales release of
this new product lineup.
In 2012 Fuji Electric released a New
high-speed, low-loss, Fuji IGBT Module output type intelligent power module
incorporating various protective functions, and completed a product series.
In 2012 Fuji Electric developed a chip which is
constructed such that a Ni-plating electrode is formed on its surface
electrodes. 2nd-generation IGBT chips feature an optimized surface trench cell
structure, and employ a new field stop structure. Diode chips incorporate an
optimized anode layer structure and utilize FZ wafers to improve forward
characteristics and improve chip reliability. These improvements make it
possible to reduce Fuji IGBT and diode chip sizes, increase system output, and
facilitate miniaturization.
A framework's topology is the thing that
manages the size and practical necessities of the force module. One-engine
frameworks for cross breeds regularly have a parallel association of the
burning motor and the electric engine/generator. That implies the force
framework can either be in motoring or producing mode, however not both.
Fuji Electric is effectively meeting
expectations with accomplices to upgrade new arrangements, and will soon report
its up and coming era of car force modules for the general business sector. The
organization has taken a two dimensional methodology to rapidly adjust to
market necessities, with an arrangement of "standard" Automotive
Power Modules manufactured to auto gauges of dependability, and the
"custom" Power Modules/Imps
Configuration builds dependably face exchange
offs in the middle of expense and execution, and making lightweight cooling
answers for IGBTS is an exemplary case, with aluminum contending to be an ease
and lighter option to copper.
Now Fuji Electric is trying to create an
aluminum cooling arrangement with execution equivalent to, if not more
prominent than, that of its copper cooling framework.
www.USComponent.com had been selling IGBT power transistor modules
since 2001. Thyssen Krupp, OTIS, IXYS, SONY DADC, General Motors, Hongkong
Electric Holdings Limited, Singapore Mass Rapid Transit Trains LTD,
Verkehrsbetriebe Zurich, Czech Airlines, Molex, Cisco, Omron, Good Year Tires,
Thai Airasia, Boeing, Xilinx, LEAR SIEGLER, and General Electric.
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