Integrated Circuit Packages

In terms of power consumption, Integrated circuits range from mW (or microwatts) to hundreds of Watts with the number of electrical connections to the next level packaging ranging from eight to more than 1,000. With this wide extent of fascinating packaging to take into account, it is not surprising that any easy generalizations will always find out anomalies.

For allowing convenient handling and assembly onto printed circuit boards and for keeping safe the devices from any possible damage, integrated circuits are implanted to protective packages. There are a huge number of various types of packages are available. Some of these types have ascertained measurements and endurances which are registered with trade industry associations like Pro Electron and JEDEC. Just one or two manufacturers might make the other types which are proprietary designations. Prior to testing and shipping devices to the customers, integrated circuit packaging is the final assembly method.

Sometimes especially processed integrated circuit dies are made for straight connections to a substrate in the absence of an in-between header or carrier. The IC is attached to a substrate by solder bumps in flip chip systems. In beam-lead technology, the metal coated pads are solidified and expanded for allowing external connections to the circuit.