The way how the IC packages mount to a
circuit board is one of the primary distinguishable package type
characteristics. Mainly there are two mounting types: through-hole (PTH) or
surface-mount (SMD or SMT). All packages fall into one of these two mounting
types. Usually through-hole packages are bigger in size and much simpler to
work with. They are designed especially to be pierced through one side of a
board and dredged to the other side.
Surface-mount
packages can be small to minuscule in size. They are all intended to be
installed on one side of a circuit board and be dredged to the surface. Most of
the times, the pins of a SMD package thrust out the side. These also steep to
the chip, or are sometimes set out in a matrix on the bottom of the chip. ICs
with surface mount packages are not very suitable to assemble with hands.
Generally special tools are needed to assist in the process.
The
most common through-hole package we meet is DIP, abbreviation for dual in-line
package. These small chips have two side-by-side rows of pins prolonging
perpendicularly out of a black, rectangular, plastic casing. There is a large
diversity of surface-mount package types these days.
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