Definition of IC Package Types

There are numerous varieties of IC packages, each of which has distinctive measures, mounting styles, and/or pin- enumerations. These packages are batched into three major categories: Dual In-line Packages, Grid Arrays and Chip Carriers. Each package, regardless of the category has a body style that scales with pin count. The number of pins determines the physical dimension of the package, the name of the package does not.

1.  Dual In-line Packages [DIP], or Dual In-Line [DIL] packages are packages with two rows of leads on two sides of the package. DIP ICs may be through-hole [PDIP or CERDIP] or SMT package [SOJ or SOIC].

2.  Quad Flat Packs or Chip Carriers are square packages [or nearly square], with leads on all four sides
    Chip Carriers, as in PLCCs and other variants are strictly Surface Mount Technology (SMT).

3.  Grid Arrays are those type packages that have their pins arranged in a grid.
    The pin grid may consist of Leads, pads, or solder balls on an area array.
    The through hole variant is called a PGA, while the SMT variant might be called LGA or BGA.