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Thursday, December 24, 2015

Field Programmable Gate Array Applications

From technical aspect, any computable problem can be solved using an FPGA. It is trivially cleared by the reality that a soft microprocessor can be implemented by FPGA. Their benefit keeps in that they are sometimes notably quicker for a number of applications because of their parallel characteristic and optimality in terms of the number of gates utilized for a particular method.

Specified uses of FPGAs comprise ASIC prototyping, digital signal processing, computer hardware emulation, software-defined radio, medical imaging, bioinformatics, computer vision, speech identification, cryptography, metal detection, radio astronomy and an increasing extent of other areas.

In the beginning, FPGAs started as challengers to CPLDs and contended in an analogous space, that of glue logic for PCBs. As their size, capacity, and speed enhanced, they started to takeover bigger and bigger functions to the point where few are now marketed as complete systems on chips (SoC). Especially with the launch of dedicated multipliers into FPGA architectures in the late 1990s, applications which had conventionally been the only reserve of DSPs started to incorporate FPGAs instead.


One more tendency on the usage of FPGAs is hardware acceleration, where one can use the FPGA to accelerate particular parts of an algorithm and share part of the computation between the FPGA and a general processor.

Tuesday, December 22, 2015

IC Packages based on Mounting Style

The way how the IC packages mount to a circuit board is one of the primary distinguishable package type characteristics. Mainly there are two mounting types: through-hole (PTH) or surface-mount (SMD or SMT). All packages fall into one of these two mounting types. Usually through-hole packages are bigger in size and much simpler to work with. They are designed especially to be pierced through one side of a board and dredged to the other side.

Surface-mount packages can be small to minuscule in size. They are all intended to be installed on one side of a circuit board and be dredged to the surface. Most of the times, the pins of a SMD package thrust out the side. These also steep to the chip, or are sometimes set out in a matrix on the bottom of the chip. ICs with surface mount packages are not very suitable to assemble with hands. Generally special tools are needed to assist in the process.


The most common through-hole package we meet is DIP, abbreviation for dual in-line package. These small chips have two side-by-side rows of pins prolonging perpendicularly out of a black, rectangular, plastic casing. There is a large diversity of surface-mount package types these days.

Monday, December 21, 2015

Integrated Circuit and Transistor Package Types

Like transistors and computer chips, integrated circuits (ICs) are encased (hermetically sealed) by packages to keep safe the inner chip’s circuitry from tangible impairment and from any kind of defilement like moisture and dust.

Other than these, the IC package also aids with redistributing the Input & output of the chips circuitry to a user-friendly component size for use by its end user, along with allowing a structure more congenial to standardization, allowing a fervent heat course away from the chip, providing safeguard from the likelihood of errors because of alpha particles and other various radiations, and providing a composition that more conveniently allows electrical experiment and burn-in by the chip's maker.

The IC package may also be effective to connect more than one IC both directly to one another utilizing standard interconnection technologies like wire bonding, and indirectly utilizing interconnection pathways available on the package such as those used in hybrid IC packages and multi-chip modules (MCMs).

The packages also make it simpler to install the ICs in different types of equipment, as every package comprises leads which may be either plugged into corresponding sockets or plugged into mounting frames. Various types of materials are used to manufacture IC packages.

Friday, December 18, 2015

IC Packages

IC (Integrated Circuit) means an assemblage of electronic components such as resistors, transistors, capacitors, etc. All these are crammed into a very small chip and attached with each other to acquire a common objective.

The IC package is what encases the die of integrated circuit and extends it out into a device we can more conveniently attach to. Every external connection on the die is linked via a very small piece of gold wire to a pad or pin on the packaging. The silver, extruding terminals on an IC are the pins. These pins carry out the work to link to different components of a circuit. These are of highest significance to us whereas they are what will go on to connect to the remaining elements and wires in a circuit.

Every IC is polarized and each is pin is distinctive in case of both position and operation. For this reason, it is necessary for the package to have some way to impart which pin is which. For most ICs, a dot or a notch (in some cases, both or sometimes anyone of them) designates the first pin. If you can recognize the first pin, the rest of the pin numbers increase according to the sequence as you move counter-clockwise around the chip.

Definition of IC Package Types

There are numerous varieties of IC packages, each of which has distinctive measures, mounting styles, and/or pin- enumerations. These packages are batched into three major categories: Dual In-line Packages, Grid Arrays and Chip Carriers. Each package, regardless of the category has a body style that scales with pin count. The number of pins determines the physical dimension of the package, the name of the package does not.

1.  Dual In-line Packages [DIP], or Dual In-Line [DIL] packages are packages with two rows of leads on two sides of the package. DIP ICs may be through-hole [PDIP or CERDIP] or SMT package [SOJ or SOIC].

2.  Quad Flat Packs or Chip Carriers are square packages [or nearly square], with leads on all four sides
    Chip Carriers, as in PLCCs and other variants are strictly Surface Mount Technology (SMT).

3.  Grid Arrays are those type packages that have their pins arranged in a grid.
    The pin grid may consist of Leads, pads, or solder balls on an area array.
    The through hole variant is called a PGA, while the SMT variant might be called LGA or BGA.

Thursday, December 17, 2015

Integrated Circuit Packages

In terms of power consumption, Integrated circuits range from mW (or microwatts) to hundreds of Watts with the number of electrical connections to the next level packaging ranging from eight to more than 1,000. With this wide extent of fascinating packaging to take into account, it is not surprising that any easy generalizations will always find out anomalies.

For allowing convenient handling and assembly onto printed circuit boards and for keeping safe the devices from any possible damage, integrated circuits are implanted to protective packages. There are a huge number of various types of packages are available. Some of these types have ascertained measurements and endurances which are registered with trade industry associations like Pro Electron and JEDEC. Just one or two manufacturers might make the other types which are proprietary designations. Prior to testing and shipping devices to the customers, integrated circuit packaging is the final assembly method.


Sometimes especially processed integrated circuit dies are made for straight connections to a substrate in the absence of an in-between header or carrier. The IC is attached to a substrate by solder bumps in flip chip systems. In beam-lead technology, the metal coated pads are solidified and expanded for allowing external connections to the circuit.

Wednesday, December 16, 2015

Integrated Circuit Design

IC design or Integrated Circuit design is a sub-category of electronic engineering, encircling the specific logic and circuit design techniques needed to design integrated circuits, or ICs. ICs comprise small-scale electronic components such as resistors, transistors, capacitors, etc. fabricated into an electrical grid on a monolithic semiconductor.

Digital and analog IC designs are the two wide categories of IC design. Components like microprocessors, FPGAs, different memories (such as: RAM, ROM, and flash) and digital ASICs are produced by digital IC design. Digital design’s main focusing points are logical rightness, ensuring maximum circuit density, and placing circuits to ensure efficient routing of clock and timing signals. Power IC design and RF IC design are the fields in which Analog IC design has specialism. Analog IC design is used in the design of phase locked loops, op-amps, oscillators, linear regulators and active filters. Analog design bothers about the physics of the semiconductor devices like resistance, gain, power dissipation and matching. Integrity of analog signal amplification and filtering is generally critical and for this reason, analog integrated circuits use comparatively bigger area active devices than digital IC designs and commonly not so much dense in circuitry.

Monday, December 14, 2015

History of Field-Programmable Gate Array

PROM and PLD (Programmable Logic Devices) are the two fields which FPGA industry germinated from. Both of these had the course of action of being programmed in groups in a factory of in the field (in case of the field programmable). Nevertheless, programmable logic was permanently connected within logic gates.

At the last of 1980s, Steve Casselman proposed for an experiment to build a computer which would apply six lacs reprogrammable gates. This experiment was funded by the Naval Surface Warfare Center. A patent concerned to the system was issued in 1992 after a successful test by Casselman.

Patents were awarded to David W. Page and LuVerne R. Peterson in 1985 in which many of the industry's foundational concepts and technologies for programmable logic arrays, gates, and logic blocks were established.

In 1983, Altera was established and brought the industry’s maiden reprogrammable logic device in 1984 – the EP300–which had a extra feature of quartz window in the package which allowed users to shine an ultra-violet lamp on the die to erase the EPROM cells that held the device configuration.


The XC2064- the first commercially viable field-programmable gate array invented in 1985 by Xilinx co-founders Ross Freeman and Bernard Vonderschmitt.

Saturday, December 12, 2015

Self-healing Electronics is Coming With Extended Life and for Reducing Waste

A total chip or even the entire device can collapse, if just one very small circuit within an integrated chip stops working or fails. Wouldn’t it be fantastic, if it could repair itself, and repair itself so quickly that the user never realized there was a fault?

A self-healing system has been developed by a team of engineers from University of Illinois. It is capable of reinstating electrical conductivity to a faulty circuit in less time than it takes to flicker. Aerospace engineering professor Scott White and materials science and engineering professor Nancy Sottos are the leaders of this team of researchers. They disclosed their results in the journal Advanced Materials.

"It simplifies the system," said chemistry professor Jeffrey Moore, a co-writer of the paper. "Rather than having to build in redundancies or to build in a sensory diagnostics system, this material is designed to take care of the problem itself."

Now-a-days manufacturers are putting as much density onto a chip as possible because electronic devices are evolving to execute more advanced tasks. Because of this kind of density, reliability is compromised. For example, failure stemming from unstable temperature cycles as the device operates or exhausts. The entire device can be shut down because of a failure at any point.

"In general there's not much avenue for manual repair," Sottos said. "Sometimes you just can't get to the inside. In a multilayer integrated circuit, there's no opening it up. Normally you just replace the whole chip. It's true for a battery too. You can't pull a battery apart and try to find the source of the failure."

Except some significant applications – like instruments or vehicles for space or military functions where electrical failures cannot be replaced or repaired, most other consumer devices are intended to be replaced with some frequency, adding to electronic waste issues.

In the past, a system for self-healing polymer materials was developed by the Illinois team and they opted to adapt their technique for conductive systems. They disseminated very small microcapsules which are tiny as 10 microns in diameter, on top of a gold line acting as a circuit. When a cleft inseminates, the microcapsules break open and release the liquid metal contained inside. To reinstate electrical flow, the liquid metal fills up the gap in the circuit.

"What's really cool about this paper is it's the first example of taking the microcapsule-based healing approach and applying it to a new function," White said. "Everything prior to this has been on structural repair. This is on conductivity restoration. It shows the concept translates to other things as well."

Because of the immediate filling of the crack by the liquid metal, the current flow is interrupted for mere microseconds by a failure. It is attested by the researchers that 90% of their samples healed to 99 percent of initial conductivity, even with a small amount of microcapsules.

Being localized and autonomous are the other advantages of the self-repairing system. Only those microcapsules are opened, which are intercepted by crack, so repair only takes place at the point of damage. In addition to that, no human interference or diagnostics is needed, which is a blessing for those applications where accessing a cleft for repair is not possible, such as a battery, or searching for the source of a failure is very difficult, such as an air- or spacecraft.

Friday, December 11, 2015

Home Diagnostic Tests Could Be Enabled By Microfluidic Integrated Circuit

Microfluidic integrated circuits have been originated by the researchers of University of Michigan as a technique to make simple lab-on-a-chip devices that could offer faster, low-cost and more portable medical tests.

These microfluidic circuits control the flowing of fluid through their devices without directions from outside systems. This process is similar to the computer chips where electronic circuits intelligently route the flow of electricity without external controls

A paper on the technology is recently disclosed online in Nature Physics.

A microfluidic device, or lab-on-a-chip, combines more than one laboratory operations onto one chip only centimeters in size. The devices make allowance for the researchers to experiment with very small sample sizes, and also to perform multiple experiments on the same material at the same time. They can be cut out to simulate the human body more nearly than the Petri dish does. They could lead to on-the-spot home tests for illnesses, food contaminants and toxic gases are major among other advances.

"In most microfluidic devices today, there are essentially little fingers or pressure forces that open and close each individual valve to route fluid through the device during experiments. That is, there is an extra layer of control machinery that is required to manipulate the current in the fluidic circuit," said Shu Takayama, the principal investigator on the project. Takayama is an associate professor in the U-M Department of Biomedical Engineering.

That's same to how electronic circuits were manipulated a century before. Then, with the improvement of the integrated circuit, the "thinking" became embedded in the chip itself -- a technical step forward that enabled personal computers, Takayama said.

"We have literally made a microfluidic integrated circuit," said Bobak Mosadegh, a doctoral student in Takayama's lab who is first writer of the paper.

The outer controls that power today's microfluidic devices may be inconvenient. Every valve on a chip (and there could be dozens of them) needs its individual electromechanical push from an off-chip actuator or pump. This has made it hard to shrink microfluidic systems to palm- or fingertip-sized diagnostic devices.

The Takayama lab's innovation is a step in this direction. His research group has devised a strategy to produce the fluidic counterparts of key electrical components including transistors, diodes, resistors and capacitors, and to efficiently network these components to automatically regulate fluid flow within the device.

Because of the use of conventional techniques in the making of these components, they are suitable for all other microfluidic components such as mixers, filters and cell culture chambers.

"We've made a versatile control system," Mosadegh said. "We envision that this technology will become a platform for researchers and companies in the microfluidics field to develop sophisticated self-controlled microfluidic devices that automatically process biofluids such as blood and pharmaceuticals for diagnostics or other applications.

"Just as the integrated circuit brought the digital information processing power of computers to the people, we envision our microfluidic analog will be able to do the same for cellular and biochemical information."


The university is pursuing patent protection for the intellectual property, and is seeking commercialization partners to help bring the technology to market.

Tuesday, December 8, 2015

Wafer-Scale Graphene Integrated Circuit

It is alleged by the scientists of IBM research that they have reached a milestone in forming a building block for the subsequent wireless devices. In a paper disclosed in the journal Science, IBM researchist made public the maiden integrated circuit built from wafer-size graphene, and revealed a broadband frequency mixer functioning at frequencies up to 10 gigahertz (10 billion cycles per second).

Aimed at wireless communications, this analog integrated circuit based on graphene would make better recent wireless devices and beckons to the possibility for a new set of applications. Among the conventional frequencies of present, transceiver and cell phone signals could be advanced, possibly allowing phones to function where they can't today while, at much higher frequencies, military and medical personnel could see covert weapons or operate medical imaging without the similar radiation riskiness of X-rays.

Graphene is the narrowest electronic material which is composed of a single layer of carbon atoms packed in a honeycomb formation, possesses exceptional electrical, mechanical, optical and thermal characteristics that could make it not so much costly and use less power in mobile electronics like smart phones.

In spite of noteworthy scientific advancement in the comprehension of this unprecedented material and the demonstration of high-performance graphene-based devices, the difficulty of combining graphene transistors with other components on an individual chip had not been cognized up to now, majorly because of the deficient adherence of graphene with metals and oxides and the need of dependable fabrication schemes to generate formative circuits and devices.

This latest integrated circuit is composed of a graphene transistor and a set of two inductors compactly built-in on a silicon carbide (SiC) wafer, surpasses these design obstacles by advancing wafer-scale fabrication methods that keep up the standard of graphene and, at the same time, make allowance for its consolidation to other elements in an intricate circuitry.

In this presentation, thermal annealing of SiC wafers synthesized graphene to comprise stable graphene layers on the surface of SiC. Four layers of metal and two layers of oxide are needed by the fabrication of graphene circuits to make top-gated graphene transistor, interconnects and on-chip inductors.

The circuit functions as a broadband frequency mixer, which generates output signals with varied frequencies (aggregate and difference) of the input signals. Mixers are considered as basic elements of various electronic communication systems. This graphene integrated circuit has been presented as capable of frequency mixing up to 10 GHz and fantastic thermal stability up to 125°C.

The fabrication scheme demonstrated can also be used in other types of graphene materials, including chemical vapor deposited (CVD) graphene films synthesized on metal films, and are also suitable for optical lithography for minimized cost and throughput. In the past, the team has demonstrated stand-alone graphene transistors with a cut-off frequency as high as 100 GHz and 155 GHz for epitaxial and CVD graphene, for a gate length of 240 and 40 nm, respectively.

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Friday, December 4, 2015

FPGA Design and Programming

A schematic design or a hardware description language (HDL) is provided by the user to define the behavior of the FPGA. The HDL form should be used to work with huge structures because it is feasible to exactly specify them by numbers rather than having to draw every piece manually. On the other hand, simpler visualization of a design is the main advantage of schematic entry.

Then, utilizing an electronic design automation tool, a technology-mapped netlist is created. The netlist can then be fitted to the real FPGA architecture using a method called place-and-route, usually executed by the FPGA Company’s proprietary place-and-route software. The user will validate the map, place and route results via timing analysis, simulation, and other verification methodologies. Once the design and validation process is done, the binary file generated (also using the FPGA company's proprietary software) is used to (re)configure the FPGA. This file is shifted to the FPGA/CPLD via a serial interface (JTAG) or to an external memory device.


VHDL and Verilog are the most common HDLs, though in order to minimize the complexity of designing in HDLs, which are in comparison to the equiponderant to the assembly languages, there are steps to increase the abstractiveness level through the introduction of substitute languages. For targeting and programming FPGA hardware, an FPGA add-in module is available to National Instruments' LabVIEW graphical programming language (sometimes referred to as "G").

Thursday, December 3, 2015

Applications of FPGA

From technical aspect, any computable problem can be solved using an FPGA or Field Programmable Gate Array Applications. It is trivially cleared by the reality that a soft microprocessor can be implemented by FPGA. Their benefit keeps in that they are sometimes notably quicker for a number of applications because of their parallel characteristic and optimality in terms of the number of gates utilized for a particular method.

Specified uses of FPGAs comprise ASIC prototyping, digital signal processing, computer hardware emulation, software-defined radio, medical imaging, bioinformatics, computer vision, speech identification, cryptography, metal detection, radio astronomy and an increasing extent of other areas.

In the beginning, FPGAs started as challengers to CPLDs and contended in an analogous space, that of glue logic for PCBs. As their size, capacity, and speed enhanced, they started to takeover bigger and bigger functions to the point where few are now marketed as complete systems on chips (SoC). Especially with the launch of dedicated multipliers into FPGA architectures in the late 1990s, applications which had conventionally been the only reserve of DSPs started to incorporate FPGAs instead.


One more tendency on the usage of FPGAs is hardware acceleration, where one can use the FPGA to accelerate particular parts of an algorithm and share part of the computation between the FPGA and a general processor.

Tuesday, December 1, 2015

Definition of FPGA

A genre of integrated circuit which is intended to be configured by a designer or the customer is called FPGA (Field-Programmable Gate Array). It is entitled as “field-programmable” because FPGAs are configured after manufacturing. Usually a Hardware Description Language (HDL) is used to specify FPGA configuration which is analogous to that utilized in an application-specific integrated circuit (ASIC). (Circuit diagrams were used in the past to specify the configuration, as they were for ASICs, but this is progressively uncommon.)

FPGAs comprise a layout of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the blocks to be "wired together", like different logic gates that can be inter-wired in various configurations. It is possible to configure logic blocks to execute complex combinational functions, or just uncomplicated logic gates like “AND” and “XOR”. In most FPGAs, logic blocks also comprehend memory elements, which can be simple flip-flops or more completed blocks of memory.

For implementing complex digital computations, contemporaneous field-programmable gate arrays (FPGAs) have huge resources of logic gates and RAM blocks. It turns into a challenge to confirm accurate timing of valid data within setup time and hold time because FPGA designs employ very fast I/Os and bidirectional data buses.