IXYS
UK Westcode have today introduced the maximal true current rating press-pack
IGBT available that is set to break new ground in power handling capability of
an individual device. The latest symmetric blocking device with a incessant DC
rating of 2.8Kv has a unprecedented DC current of 6000A. The latest device has
been aided by IXYS UK’s comprehensive expertise in making and understanding the
principles of very big press-pack IGBTs with more than one parallel die. The
recently developed 4.5Kv devices include vindicated SPT plus die technology and
are built using 52 parallel connected IGBT die, 10 more than the biggest
established part with a current rating of 2400A at the same 4.5Kv blocking
voltage. Every die is 14.3mm square with an active area of nearly one
centimetre squared. The latest device encapsulated in completely sealed 26mm
thick with a 132mm electrode diameter, bigger than the traditional 2400A
device, but keep up the similar 170mm in-total diameter as the 42 die design;
this provides an effective 25% more current rating in the same package.
The
sturdy internal development is without bond with the single die straight away
pressure contacted through metallic pressure plates to the outside copper
electrodes. The outright bond free contact confirms maximum reliability and
unparalleled thermal cycling properties, far exceeding those of a
conventionally packaged plastic package module. In particular, the short
circuit failure mode makes these devices the obvious choice for applications
requiring series operation, such is the case in utilities, HVDC and very large
medium voltage drives. The unrivalled current rating can also reduce the number
of parallel paths required in very high current applications in the multi
megawatts range. Generally, these devices are well suited to harsh environments
and where maintenance access is difficult such as off-shore marine and wind.
The hermetic structure and high rupture resistance are properties which are
particularly relevant in harsh environments where explosive failure and plasma
leak are unacceptable, such as mining, gas and oil instillation. The package
design is based on IXYS UK’s proven technology, with the same conveniences of
enhanced rupture capability, resisting more than ten times the short circuit energy
of a conventional plastic packaged module device and the additional advantage
that the device is virtually guaranteed to fail to a stable short circuit.
These unique properties make the new device an ideal solution where high
reliability, maximum power density and predictable failure are important. To
facilitate the application of this new higher rated press-pack IGBT, IXYS UK
Westcode has also launched a new complementary diode in its range of very high
di/dt HP Sonic FRDs. This new diode is constructed using a new die bonding
technology to maximize reliableness.
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