Mitsubishi Electric Corporation
declared today that it has built up a cutting edge power module called X-Series
New Dual HVIGBT module for footing and electric force applications in
overwhelming commercial ventures. The new module highlights higher force
thickness and proficiency for inverters and in addition an institutionalized
bundle that considers an adaptable configuration of inverter frameworks.
Tests of the 3.3kV (LV100)
variant of the New Dual module will be accessible for transportation from March
2017. That will be trailed by 1.7kV, 3.3kV (HV100), 4.5kV and 6.5kV variants in
a specific order from 2018 onwards. The organization additionally plans to add a
lower-than 1.7kV rendition to the lineup later on.
High-control modules are key
gadgets for controlling force transformation in electronic frameworks in an
extensive variety of force classes from a few kilowatts up to a few megawatts.
Up to this point, modules with the greatest voltage rating of up to 6.5kV and a
most extreme current rating of a few thousand amperes have been monetarily
accessible.
The New Dual HVIGBT module will
fulfill interest for productive, high power thickness semiconductor gadgets
with a scope of current and voltage evaluations, while adding to higher force
yield and proficiency in inverters by embracing the most recent seventh-era
IGBTs and RFC diodes. Then, the institutionalized bundle measurements will
permit makers of mechanical gadgets to disentangle plan and secure numerous
hotspots for inverters.
Item Features:
1. Contributing to high vitality
effectiveness and high power thickness •The seventh-era IGBTs receiving CSTBTTM
and RFC diodes acknowledge low power misfortune in inverter frameworks.
• Improved bundle innovation and
low parasitic inductance empower the greatest execution.
• Three AC fundamental terminals
on the LV100 bundle spread and even out current thickness, adding to expanded
inverter capacity.
2. Common edge size backings
more various inverter setups and limit •LV100 and HV100 modules have a typical
bundle plan.
• Simple, standard associations
take into consideration ideal framework outline and a scope of current
evaluations.
• Lineup ranges from 1.7 to
6.5kV.
• Improved adaptability and
versatility for framework design.
3. Contributing to higher
configuration productivity by the utilization of an institutionalized new
bundle
• Compatible
with terminal and connection areas of Infineon Technologies AG (Germany) items.
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