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Tuesday, November 28, 2017

IXYS Corporation Discloses 3600V Reverse Conducting IGBTs (BiMOSFETs™)

IXYS Corporation is a prominent maker of power semiconductors, integrated circuits and RF powers. Their products are built for power management, energy efficiency, and motor control applications. This company is going to release a new 3600V Reverse Conducting IGBT (BiMOSFETs™). We will get combined strengths of both MOSFETs and IGBTs by using this new transistor. Featuring “free” intrinsic body diodes and current ratings from 45A to 125A, these are perfect for high speed, high voltage, and high current power conversion applications.

Power transistor makers will be able to get rid of lower current rated devices and multiple series-parallel lower voltages if they use these high voltage BiMOSFETs™. As a result, the number of power components required will be reduced and their associated gate drive circuitry will be simplified. These will lower the system costs and the reliability will also be improved.

Besides, if required, credits to the favorable heat coefficient of the on-state voltage and diode forward voltage, these modules can be operated in collateral to meet even higher current necessities. Moreover, in the course of turn-off transition, the inherent body diode provides a path for the inductive load current, inhibiting high voltage transients from imposing harm to the device.

“We at IXYS pioneered the concept of the reverse conducting IGBT which we call the ‘BiMOSFET’ family since it combines the best features of the power MOSFET and the BJT in one monolithic chip. It evolved from our invention of the Reverse Blocking IGBT, as covered in our US Patents No. 5,698,454, 6,091,086 and 6,936,908. We now extended the voltage rating of these devices to enable simpler high voltage conversion circuits with FET-like gate controls,” commented Dr. Nathan Zommer, CEO of IXYS Corporation, and co-inventor of this technology.

Various types of power switching systems can be benefitted by using the new 3600V BiMOSFETs™. Capacitor discharge circuits and AC switches, uninterruptible power supplies, switched mode and resonant mode power supplies, laser and X-ray generators are included to this list.

These inverse conducting IGBTs are obtainable in the below international standard size packages: ISOPLUS i4-Pak™, ISOPLUS i5-Pak™, and TO-247PLUS-HV. The first two packages supply an electrical isolation of 4000V through the Direct Copper Bond (DCB) substrate technology.

IXYS Corporation manufactures and sells technology-based products to enhance power conversion efficacy, generate solar and wind power, and provide effective motor control for industrial applications. IXYS provides a diverse product base that addresses worldwide needs for power control, electronic displays, and RF power, electrical efficiency, renewable energy, telecommunications, medical devices.

http://www.uscomponent.com had been selling IGBT power transistor modules since 2001. Thyssen Krupp, OTIS, IXYS, SONY DADC, General Motors, Hongkong Electric Holdings Limited, Singapore Mass Rapid Transit Trains LTD, Verkehrsbetriebe Zurich, Czech Airlines, Molex, Cisco, Omron, Good Year Tires, Thai Airasia, Boeing, Xilinx, LEAR SIEGLER, and General Electric.

http://www.uscomponent.com has a Quality Control Team like no other. This means that we know how to work hard in order to ensure to make sure that the quality of all of the parts we’re selling is high. Because we only sell new and original electronic parts, we provide our customers with a 30-day warranty. And because we have connections with IGBT power transistor modules manufacturers, OEMs and distributors, we’re able to pass any savings on to our customers, giving them a lower price while still providing them with the quality products they deserve. Our inventory is carefully managed and held to the highest standards, and stored in a controlled environment warehousing facility.

Monday, November 27, 2017

History of FPGA and Its Invention by Xilinx

Semiconductor Devices which are founded around a matrix of configurable logic blocks (CLBs) and linked through programmable interconnects known as Field Programmable Gate Arrays (FPGAs). These semiconductors can be reprogrammed for the intended applications and operational necessities after manufacture. Because of this distinctive feature, FPGAs are different from Application Specific Integrated Circuits (ASICs). ASICs are custom made for particular applications. Though one-time programmable (OTP) FPGAs are there, most types are based on SRAM which can be reprogrammed as the design advances.

ASIC and FPGAs have various value propositions, and they require to be carefully assessed before choosing anyone over the other. Information is easily available about comparison between these two technologies. Today’s FPGAs thrust the 500MHz performance hurdle without any problem, though FPGAs used to be chosen for lower volume/speed/complexity design traditionally. With unprecedented logic density increases and a host of other features, such as embedded processors, DSP blocks, clocking, and high-speed serial at ever lower price points, FPGAs are an enthralling choice for nearly any type of design.

PROM (Programmable Logic Devices) and PLD (Programmable Logic Devices) are the two fields which FPGA industry germinated from. Both of these had the course of action of being programmed in groups in a factory of in the field (in case of the field programmable). Nevertheless, programmable logic was permanently connected within logic gates.

At the last of 1980s, Steve Casselman proposed for an experiment to build a computer which would apply six lacs re-programmable gates. This experiment was funded by the Naval Surface Warfare Center. A patent concerned to the system was issued in 1992 after a successful test by Casselman.

Patents were awarded to David W. Page and LuVerne R. Peterson in 1985 in which many of the industry's foundational concepts and technologies for programmable logic arrays, gates, and logic blocks were established.

In 1983, Altera was established and brought the industry’s maiden reprogrammable logic device in 1984 – the EP300–which had a extra feature of quartz window in the package which allowed users to shine an ultra-violet lamp on the die to erase the EPROM cells that held the device configuration.

The XC2064- the first commercially viable field-programmable gate array invented in 1985 by Xilinx co-founders Ross Freeman and Bernard Vonderschmitt.

From technical aspect, any computable problem can be solved using field programmable gate arrays. It is trivially cleared by the reality that a soft microprocessor can be implemented by FPGA. Their benefit keeps in that they are sometimes notably quicker for a number of applications because of their parallel characteristic and optimality in terms of the number of gates utilized for a particular method.

FPGAs are perfectly suitable for various markets. Being the pioneer in the industry, Xilinx offers extensive solutions comprising FPGA devices, advanced software, and configurable, ready-to-use IP cores for markets and applications such as: Aerospace & Defense, ASIC Prototyping, Audio, Automotive, Broadcast, Consumer Electronics, Data Center, High Performance Computing and Data Storage, Industrial, Medical, Security, Video and image processing, wired communication and wireless communication.

Sunday, November 26, 2017

FPGA Design & Programming and Comparison to ASIC

A schematic design or a hardware description language (HDL) is provided by the user to define the behavior of the FPGA. The HDL form should be used to work with huge structures because it is feasible to exactly specify them by numbers rather than having to draw every piece manually. On the other hand, simpler visualization of a design is the main advantage of schematic entry.

Then, utilizing an electronic design automation tool, a technology-mapped netlist is created. The netlist can then be fitted to the real FPGA architecture using a method called place-and-route, usually executed by the FPGA Company’s proprietary place-and-route software. The user will validate the map, place and route results via timing analysis, simulation, and other verification methodologies. Once the design and validation process is done, the binary file generated (also using the FPGA company's proprietary software) is used to (re)configure the FPGA. This file is shifted to the FPGA/CPLD via a serial interface (JTAG) or to an external memory device.

VHDL and Verilog are the most common HDLs, though in order to minimize the complexity of designing in HDLs, which are in comparison to the equiponderant to the assembly languages, there are steps to increase the abstractiveness level through the introduction of substitute languages. For targeting and programming FPGA hardware, an FPGA add-in module is available to National Instruments' LabVIEW graphical programming language (sometimes referred to as "G").

Formerly, FPGAs (Field programmable Gate Array) lagged behind than their rigid ASIC (Application-specific integrated circuit) peers in terms of operational speed, energy efficiency and overall functionality. It was demonstrated by an older research that designs executed on FPGAs require on an average 40 times as much area, pull 12 times as much dynamic power, and achieve one third the speed of resembling ASIC executions. In the modern days, FPGAs like Virtex-7 from Xilinx or Stratix 5 from Altera have taken place to contend with resembling ASIC and ASSP solutions by providing notably minimized power, extended speed, and decreased cost of materials, least execution real-estate and expanded likelihood for re-configuration 'on-the-fly'. A design can now be attained using just one FPGA where 6-10 ASIC may have been used in the same design in the past.

Conveniences of FPGAs comprise the facility to reprogram in the area to fix bugs, and can comprise a briefer time for marketing and lesser non-recurring engineering expenses. A moderate road can be taken by the vendors by developing their hardware on common FPGAs, but manufacture their ultimate version as an ASIC. As a result of this, it cannot be modified any longer after the design has been implemented.

Specified uses of FPGAs comprise ASIC prototyping, digital signal processing, computer hardware emulation, software-defined radio, medical imaging, bioinformatics, computer vision, speech identification, cryptography, metal detection, radio astronomy and an increasing extent of other areas.

In the beginning, FPGAs started as challengers to CPLDs and contended in an analogous space, that of glue logic for PCBs. As their size, capacity, and speed enhanced, they started to takeover bigger and bigger functions to the point where few are now marketed as complete systems on chips (SoC). Especially with the launch of dedicated multipliers into FPGA architectures in the late 1990s, applications which had conventionally been the only reserve of DSPs started to incorporate FPGAs instead.

One more tendency on the usage of FPGAs is hardware acceleration, where one can use the FPGA to accelerate particular parts of an algorithm and share part of the computation between the FPGA and a general processor.

Wednesday, November 22, 2017

IC Package Types and Definitions

IC (Integrated Circuit) means an assemblage of electronic components such as resistors, transistors, capacitors, etc. All these are crammed into a very small chip and attached with each other to acquire a common objective.

The IC package is what encases the die of integrated circuit and extends it out into a device we can more conveniently attach to. Every external connection on the die is linked via a very small piece of gold wire to a pad or pin on the packaging. The silver, extruding terminals on an IC are the pins. These pins carry out the work to link to different components of a circuit. These are of highest significance to us whereas they are what will go on to connect to the remaining elements and wires in a circuit.

Every IC is polarized and each is pin is distinctive in case of both position and operation. For this reason, it is necessary for the package to have some way to impart which pin is which. For most ICs, a dot or a notch (in some cases, both or sometimes anyone of them) designates the first pin. If you can recognize the first pin, the rest of the pin numbers increase according to the sequence as you move counter-clockwise around the chip.

The way how the IC packages mount to a circuit board is one of the primary distinguishable package type characteristics. Mainly there are two mounting types: through-hole (PTH) or surface-mount (SMD or SMT). All packages fall into one of these two mounting types. Usually through-hole packages are bigger in size and much simpler to work with. They are designed especially to be pierced through one side of a board and dredged to the other side.

Surface-mount packages can be small to minuscule in size. They are all intended to be installed on one side of a circuit board and be dredged to the surface. Most of the times, the pins of a SMD package thrust out the side. These also steep to the chip, or are sometimes set out in a matrix on the bottom of the chip. ICs with surface mount packages are not very suitable to assemble with hands. Generally special tools are needed to assist in the process.

There are numerous varieties of IC packages, each of which has distinctive measures, mounting styles, and/or pin-enumerations. These packages are batched into three major categories: Dual In-line Packages, Grid Arrays and Chip Carriers. Each package, regardless of the category has a body style that scales with pin count. The number of pins determines the physical dimension of the package, the name of the package does not.

1. Dual In-line Packages [DIP], or Dual In-Line [DIL] packages are packages with two rows of leads on two sides of the package. DIP ICs may be through-hole [PDIP or CERDIP] or SMT package [SOJ or SOIC].

2. Quad Flat Packs or Chip Carriers are square packages [or nearly square], with leads on all four sides Chip Carriers, as in PLCCs and other variants are strictly Surface Mount Technology (SMT).

3. Grid Arrays are those type packages that have their pins arranged in a grid. The pin grid may consist of Leads, pads, or solder balls on an area array. The through hole variant is called a PGA, while the SMT variant might be called LGA or BGA.

Tuesday, November 21, 2017

IGBT in Refrigerator Compressors and Induction Cookers

Refrigerators have become essential appliances in society for the preservation of food and beverages. The quality of life for people has been greatly enhanced with the availability of affordable refrigerators for homes. Most household refrigerators utilize the vapor compression cycle with a circulating refrigerant used to cool the refrigerator compartment. Household refrigerators originally used an on/off controlled, constant-speed, single-phase induction motor to drive the compressor. The poor efficiency of this approach made the refrigerator one of the highest power consumption appliances in the home. In order to improve the efficiency, modern refrigerators with the Energy star rating utilize variable-speed, three-phase induction motor drives. Current models that are Energy Star qualified use 50 percent less energy than the average models made in 1974.

The variable speed drive to the induction motor is provided using the six IGBTs in the inverter stage. The author’s state: “The total energy savings was about 40%. The system is very quiet and maintains a constant temperature within 0.1 degree Celsius which improves the quality and shelf life of food stored in the refrigerator.” Many companies have optimized IGBTs for use in refrigerator compressor drives due to the large market opportunity. Some companies have developed intelligent power modules, which combine the IGBTs, fly-back rectifiers, and the drive circuits into a single module. This provides a very compact and low cost motor drive option that can be easily adopted for the manufacturing of refrigerators.

The method of inflaming an electrically conductive object (normally a metal) using an electromagnetic induction is called Induction Heating (IH). The object is heated by eddy current or Foucault currents. Induction heating (IH) is a familiar technology and very often used for cooking appliances.

A notable volume of power is dissipated by the IGBTs used in induction heating cooking applications when the application is operated at high power levels. For this reason, big heat sinks are employed generally in order to confine the junction temperature of the IGBTs from increasing more than its recommended specification value.

An induction coil in the cook-top inflames iron bottom of cookware in induction cooking using rotational magnetic induction. Only ferrous pans can be used perfectly in induction cooking, others such as: aluminum pans, copper-bottomed pans etc are not compatible usually. The heat inclined to the bottom is transferred to the food via (metal surface) conduction. Each and every IH cooking appliance functions using the electromagnetic induction phenomenon: an AC current flowing through a circuit (ex: the heating coil) yields an inconsistent magnetic flux, thus causing eddy currents to occur in a secondary circuit (i.e. the load to be heated).

Advantages of induction cookers comprise potency, protection (the induction cook-top is not het itself) and fastness. Both permanently installed and portable induction cookers are available in the market. You have the option to choose between fixed and portable induction cookers according to your need.


Because of using large heat sinks to meet the maximum junction temperature requirement, the aggregate cost of the IH cookers raises. Despite their higher initiatory cost compared to gas or electric cooking appliances and the need for special pans made of ferromagnetic materials, IH cooking appliances present benefits such as high energy efficiency, fast and safe cooking, and easy to clean cooktops that have made them popular around the world. The market for induction heating applications will grow tremendously, if production costs can be reduced, and more efficient induction heating cookers can be developed.

Monday, November 20, 2017

FZ1200R33KF2C - A Durable IGBT For Motor Control

If you decide to use FZ1200R33KF2C in your traction and industrial applications, you do not have to worry about performance and reliability. FZ1200R33KF2C is a 3300V/1200A IHV 190mm single switch IGBT diode-inverter with IGBT2. Its weight is 8.82 lbs. It is a switch that is used in order to allow power flow in the on state and to stop power flow when it is in the off state. It works by applying voltage to a semiconductor component, therefore changing its properties to block or create an electrical path. You will be more than satisfied with its build quality. The module is very sturdy and highly dependable. It is manufactured by Infineon Technologies AG, a prominent semiconductor supplier from Germany. Infineon is famous for their sophisticated product lineup, which addresses three central challenges to the modern society: energy efficiency, mobility, and security. Eupec is the previous name of Infineon Technologies.

FZ1200R33KF2C features high energy consistency for compact inverter models. Its housing is standardized too. It is an IGBT device that combines the voltage characteristics of a biopolar transistor (collector – emitter) and the drive characteristics of a MOSFET. The target applications of FZ1200R33KF2C are Motor Control and Drives, Railway Traction, Wind Energy Systems, Commercial, Agriculture and Construction Vehicles (CAV) etc.

In today's competitive & dynamic environment, there is a continuous pressure to find new methods to increase energy efficiency, mobility and security in all motor control applications. At the same time, software's progressively important role in systems directly contributes to their complexity and increases costs. Today's motors are increasingly driven via electronic controls, which provide better control of speed, position, and torque, as well as much better efficiency, rather than via direct connection to their source of power (whether AC or DC). To do this, the motor-control circuit must switch the current flow to the motor's coils on and off quickly, with minimal switching-time or conduction-period losses in the switch itself. That's where FZ1200R33KF2C is used. This semiconductor device serves the needs of motor drive and power control. This electrically controllable switch controls the current flow path to two or more motor coils. This allows full control of the motor speed and direction. FZ1200R33KF2C is such a module which is widely used in different machineries and apparatuses.

A hybrid vehicle system consists of an electric motor, a battery and an inverter. An electric power conversion system is needed to supply electrical energy from the battery to the motor, and to store energy generated by the motor in the battery. The inverter is used as that power conversion system FZ1200R33KF2C is one of the most common modules to use as the main switching device in this electric power conversion system.

There are some specific motor control applications which FZ1200R33KF2C are most suitable for. These are brushed DC motor, brushless DC motor, induction motor, servo motor, stepper motor, switched reluctance motor, permanent magnet synchronous motor, Industrial automation etc.

Established in Houston, TX in 2001, Young & New Century LLC has been selling IGBT power transistor modules like FZ1200R33KF2C. Our company specializes in selling electronic components of various manufacturers for a whole range of your industrial applications. Please take a look at our website http://www.uscomponent.com. You can send a request for quote for you required part. You can send your RFQ via an email also to sales@uscomponent.com.

Friday, November 17, 2017

FZ1200R16KF4 - A Highly Reliable IGBT From Infineon

FZ1200R16KF4 is a 1600V IHM 130mm single switch IGBT (Insulated Gate Bipolar Transistor) Module with IGBT2 which is made by Infineon, formally known as Eupec who is one of the leading manufacturers and suppliers of semiconductors and system solutions. It is a 3-phase full-bridge power module including fast free-wheel diodes package with insulated metal base plate. It is the best solution for your traction and industry applications. In terms of energy, there are three central requirements of our modern society. They are: efficiency, mobility and security. Infineon provides semiconductor and system solutions, focusing on these three central needs.

Modern train traction systems use high-speed switching IGBTs in main circuits. High-speed switching reduces electromagnetic noise generated by the main motor and improves the efficiency of energy conversion. For the inverter control system, vector control is employed to control the torque current component and the exciting current component separately, which are output to the induction motor.

In modern, intense and heavy traction applications like: locomotives, long-distance trains, metros and trams, which move on a world-wide variety of railroad networks, FZ1200R16KF4 is employed. You can find them in metro drive systems, in innovative, high speed trains and in auxiliary inverters. There is hardly any other application that puts such high demands on the components as traction. High quality, reliability and lifetime are the most important product features in this market segment. FZ1200R16KF4 has advantages like ongoing development for higher voltage and current ratings and these benefits makes them really obligate in traction appliances. There is barely any other application that puts such high pressure on the components as traction. One important requirement is the ability to withstand power cycles. Power cycles cause temperature changes which lead to a mechanical stress that can turn into a failure. High quality, reliability and lifetime are the most important product features in this market segment. FZ1200R16KF4 is a very capable device which can fulfill all these requirements.

Due to its advantages in terms of fast switching, ruggedness, simplicity of gate drive and ease of use, the use of Infineon modules is widespread. While the IGBT can limit and commutate current due to normal fault events, the traction environment may present situations where extensive energy is conducted through the module. Compared to alternative solutions, these can reduce 40 to 50% in inverter cost, weight, and volume. However, the fast switching operation requires special attention to reduce the circuit inductance to avoid overvoltage at switching. Another issue worth consideration is the ability of the module to manage faults without allowing extensive rupture or explosion.

By providing the latest technology, Infineon’s solutions allow their customers to enjoy the benefits of standardized housings combined with maximum reliability. They offer wide portfolio of innovative components tailored to needs of various traction and auxiliary inverters.


http://uscomponent.com is an IGBT distributor selling Eupec Infineon IGBTs such as FZ1200R16KF4. They have an exceptional quality control team who know how to take necessary steps to make sure that the quality of all of the parts they’re selling is high. Please do not hesitate to send us an email sales@uscomponent.com for stock check or tech support.

Wednesday, November 15, 2017

FZ1200R12KL4C - A Very Good Solution For Solar Energy Systems

Today we will know about FZ1200R12KL4C, a 1200A/1200V IHM 130mm single switch IGBT power transistor module with IGBT2 low loss and Emitter Controlled Diode. The weight of this device is 8.82 lbs. It is the perfect choice for your industry applications such as Motor Control and Drives, Solar Energy Systems, Wind Energy Systems, Uninterruptable Power Supplies, and etc. It is manufactured by famous German manufacturer Infineon Technologies who are specialist in making semiconductors and system solutions by targeting the primary needs of our modern society. Infineon was known as Eupec previously in the world of technology. High reliableness and solid module construction are the features for which FZ1200R12KL4C is exceptional. This module is recognized by UL too. We will be eligible to get some extra advantages if we use this transistor in our industry applications. High power density can be achieved for compact inverter designs by using this. Standardized housing is another attribute which makes FZ1200R12KL4C unique. We are going to have a discussion about the implementation of FZ1200R12KL4C in solar inverters. Solar power has a large potential to provide the electricity needs of the world’s burgeoning population.

However, in 2008 solar-power supplied less than 0.02% of the world's total energy supply. A solar inverter converts variable direct current (DC) output of a photovoltaic (PV) solar array panel to AC voltage. The energy produced from solar panels is used to power household appliances directly, charge batteries or feed electricity directly back to the grid in return for credit against future power bills. All of these applications need AC voltage. The DC voltage produced by the solar array must be converted into a desired well regulated AC power by using an IGBT based inverter. FZ1200R12KL4C provides advantages in solar inverter applications compared to other types of power devices. It delivers low conduction and switching losses resulting in high inverter efficiency. Benefits like high-current-carrying capability, gate control using voltage instead of current and the ability to match the co-pack diode are found when FZ1200R12KL4C is used as the power device in solar inverters.


FZ1200R12KL4C has some major advantages over MOSFETs and bipolar transistors. First, it has very low on-state voltage drops because of the conductivity modulation, in addition to superior on-state current density. These factors allow manufacturers to fabricate devices with smaller chip size and at lower cost. Second, these boast low driving power and simple driving circuits due to the input MOS gate structure. It is simpler to control compared to current controlled devices such as bipolar transistors. Third, FZ1200R12KL4C has fantastic forward and reverse blocking capabilities. These characteristics encourage designers to select this IGBT module for solar inverter applications. Young & New Century LLC is located at Houston in Texas, United States. Our official website is http://www.uscomponent.com. We have been selling IGBT power transistor modules like FZ1200R12KL4C for the last fourteen years. We sell original & new parts only. You can trust us in terms of quality because we always try to supply the authentic parts. All of our parts are backed up with 30 days warranty. Please take a look at our website for stock check or technical support.

Tuesday, November 14, 2017

FF800R17KF6C_B2 - An Ideal Dual IGT For Wind Power Systems

FF800R17KF6C_B2, a 1700V IHM 130mm Dual IGBT Module with IGBT2 Low Loss, enlarged diode and AlSiC base-plate. It’s the best solution for your renewable energy and industry applications. The module is manufactured by Infineon Technologies AG, a renowned semiconductor manufacturer from Germany. Infineon provides semiconductor and system solutions, focusing on three central needs of our modern society: Energy Efficiency, Mobility and Security. FF800R17KF6C_B2 is highly reliable and features robust module construction. It has enlarged diode for regenerative operation.

Power semiconductors have a major role to generate energy from renewable sources. In wind turbines, power semiconductors are utilized to transform power and to combine the generator with the grid. They are also made into different subsidiary drives such as pitch drives, yaw drives, pumps and into protection circuits like crowbars. A number of vital functions and applications are controlled by wind power converters and that’s why highest quality power semiconductors are required. This is applicable in specific to offshore wind converters which operate in immensely tough conditions exposed to salt, humidity etc. Speedy growth is planned for the offshore portion. FF800R17KF6C_B2 is a perfect choice in these fields.

Wind energy turbines must also be intended to deliver maximum levels of availability in order to contribute to grid stability. This applies not only to the converter, but also to the different subsidiary drives mounted in different positions. Grid stability therefore depends on power semiconductor assemblies offering dynamic capabilities, outstanding functionality and superior reliability.

Advantages like high power density for compact inverter designs & standardized housing can be found if we use FF800R17KF6C_B2 in wind power applications.

There has been flourishing global advancement in wind power generation. The sum of power produced using wind-power has raised from 7.5 Giga-Watts in 1997 to 74 Giga-Watts in 2006 with further increment happening at the rate of a doubling of generation every three to four years. It is calculated that 12 percent of the world’s electricity requirements will be supplied by wind-power in 2020. The prominent wind power generators in the world are Germany and Spain, succeeded by the United States. China is also invasively imitating wind-power generation. China blueprints to spend $ 700 Billion until 2020 in renewable energy projects. Huadian Power International Corporation, a China based company has obtained authorization to build two wind power projects with an associated capability of 147 Mega-Watts. Moreover, an Indian company, Suzlon Energy, has become the world’s eighth largest generator of wind turbine generators. Companies have also fixed on wind-power as a significant growth segment in the future.

http://www.uscomponent.com had been selling IGBT power transistor modules since 2001.Infineon, Thyssen Krupp, OTIS, IXYS, SONY DADC, General Motors, Hongkong Electric Holdings Limited, Singapore Mass Rapid Transit Trains LTD, Verkehrsbetriebe Zurich, Czech Airlines, Molex, Cisco, Omron, Good Year Tires, Thai Airasia, Boeing, Xilinx, LEAR SIEGLER, and General Electric.

http://www.uscomponent.com has a Quality Control Team like no other. This means that we know how to work hard in order to ensure to make sure that the quality of all of the parts we’re selling is high. Because we only sell new and original electronic parts, we provide our customers with a 30-day warranty. And because we have connections with IGBT power transistor modules manufacturers, OEMs and distributors, we’re able to pass any savings on to our customers, giving them a lower price while still providing them with the quality products they deserve. Our inventory is carefully managed and held to the highest standards, and stored in a controlled environment warehousing facility.

Thursday, November 9, 2017

FZ1200R12KF5 - A Perfect IGBT For Motor Control

FZ1200R12KF5 is a TRANS IGBT (Insulated Gate Bipolar Transistor) module N-CH 1200V 78A 7Half-Bridge. This module is manufactured by Infineon Technologies, Germany previously familiar as Eupec who is one of the prime manufacturers and suppliers of semiconductors and system solutions. The best applications of FZ1200R12KF5 are DC motor control, NC equipment, AC motor control, contactless switches, electric furnace temperature control, light dimmers & welders. In case of power & energy, efficiency, mobility and security are three basic needs of this modern society. Infineon has sorted their product lineup by considering these facts. FZ1200R12KF5 is an IGBT device that combines the voltage characteristics of a biopolar transistor (collector – emitter) and the drive characteristics of a MOSFET.

Prior to 1990s, the only available power semiconductor switching device was silicon GTO which had the power manipulation capability compatible for motor control applications. In the 1990s, the ratings of IGBTs had adequately advanced, to exceed one Mega-Watt allowing penetration of the IGBT into this traction market. The availability of the IGBT allowed significant improvements in the motor drive technology due to elimination of snubber circuits and an increase in the operating frequency of the inverter circuit used to deliver power to the motors. FZ1200R12KF5 is an IGBT device from Infineon which is used frequently for electric motor control.

The Motor Control Unit (MCU) is the vital part of a 100% electric-powered vehicle as it handles and regulates the electrical power supply to the electric motor to generate the necessary level of torque to power the vehicle by converting the battery packs DC voltage into three-phase AC. Inversely, the MCU is responsible for managing the electrical energy that is generated by the regenerative braking system and is fed back into the lithium-ion battery pack.

The crucial electrical components accommodated within the Motor Control Unit are a smoothing condenser to help stabilize the DC current, several FZ1200R12KF5 convert the DC electrical current into AC, a heat sink to provide cooling/heat dissipation and a control board that supervises the electric motor. The control board is located in a separate area within the MCU from the smoothing condenser, the IGBTs and the heat sink to protect it from the heat generated by these components.

Infineon Technologies has developed voltage-source inverters for AC motor drive systems with IGBT based inverters serving applications under 3,600kVA and GTO thyristor inverters for higher power levels. Because steel manufacturing lines use so many variable-speed motors, size reductions in the motor drive units can contribute to substantial savings in factory floor space that reduce investment costs. High-power-factor converters are another focus of technology development since these converters produce less reactive power and introduce lower levels of power line harmonics. FZ1200R12KF5 is an IGBT device being used in the inverters for such AC/DC motor drive systems.

http://uscomponent.com has been selling IGBT power transistor module including FZ1200R12KF5 since 2001. We have a dedicated quality control team unlike any supplier which always tries their best in order to maintain a quality. We sell original and new parts electronic parts only. Please visit our website for stock check or tech support.

Wednesday, November 8, 2017

FF800R17KF6C_B2 - An Ideal Dual IGT For Wind Power Systems

FF800R17KF6C_B2, a 1700V IHM 130mm Dual IGBT Module with IGBT2 Low Loss, enlarged diode and AlSiC base-plate. It’s the best solution for your renewable energy and industry applications. The module is manufactured by Infineon Technologies AG, a renowned semiconductor manufacturer from Germany. Infineon provides semiconductor and system solutions, focusing on three central needs of our modern society: Energy Efficiency, Mobility and Security. FF800R17KF6C_B2 is highly reliable and features robust module construction. It has enlarged diode for regenerative operation.

Power semiconductors have a major role to generate energy from renewable sources. In wind turbines, power semiconductors are utilized to transform power and to combine the generator with the grid. They are also made into different subsidiary drives such as pitch drives, yaw drives, pumps and into protection circuits like crowbars. A number of vital functions and applications are controlled by wind power converters and that’s why highest quality power semiconductors are required. This is applicable in specific to offshore wind converters which operate in immensely tough conditions exposed to salt, humidity etc. Speedy growth is planned for the offshore portion. FF800R17KF6C_B2 is a perfect choice in these fields.

Wind energy turbines must also be intended to deliver maximum levels of availability in order to contribute to grid stability. This applies not only to the converter, but also to the different subsidiary drives mounted in different positions. Grid stability therefore depends on power semiconductor assemblies offering dynamic capabilities, outstanding functionality and superior reliability.

Advantages like high power density for compact inverter designs & standardized housing can be found if we use FF800R17KF6C_B2 in wind power applications.

There has been flourishing global advancement in wind power generation. The sum of power produced using wind-power has raised from 7.5 Giga-Watts in 1997 to 74 Giga-Watts in 2006 with further increment happening at the rate of a doubling of generation every three to four years. It is calculated that 12 percent of the world’s electricity requirements will be supplied by wind-power in 2020. The prominent wind power generators in the world are Germany and Spain, succeeded by the United States. China is also invasively imitating wind-power generation. China blueprints to spend $ 700 Billion until 2020 in renewable energy projects. Huadian Power International Corporation, a China based company has obtained authorization to build two wind power projects with an associated capability of 147 Mega-Watts. Moreover, an Indian company, Suzlon Energy, has become the world’s eighth largest generator of wind turbine generators. Companies have also fixed on wind-power as a significant growth segment in the future.

http://www.uscomponent.com had been selling IGBT power transistor modules since 2001.Infineon, Thyssen Krupp, OTIS, IXYS, SONY DADC, General Motors, Hongkong Electric Holdings Limited, Singapore Mass Rapid Transit Trains LTD, Verkehrsbetriebe Zurich, Czech Airlines, Molex, Cisco, Omron, Good Year Tires, Thai Airasia, Boeing, Xilinx, LEAR SIEGLER, and General Electric.

http://www.uscomponent.com has a Quality Control Team like no other. This means that we know how to work hard in order to ensure to make sure that the quality of all of the parts we’re selling is high. Because we only sell new and original electronic parts, we provide our customers with a 30-day warranty. And because we have connections with IGBT power transistor modules manufacturers, OEMs and distributors, we’re able to pass any savings on to our customers, giving them a lower price while still providing them with the quality products they deserve. Our inventory is carefully managed and held to the highest standards, and stored in a controlled environment warehousing facility.

Monday, November 6, 2017

Power Modules Get Through, But Think Before Choosing

Power modules will come in your mind first when it is about leveraging the knowledge of the power specialists and bringing your model to the market promptly, but think before choosing. Power-module architecture selections can have an significant impact on the performance of your power supply.

Either judging step-down switching regulators at the silicon-level (moderator with FET), or power modules where the consolidation, and effortlessness of usage of a further accomplished power supply subsystem can be preferable, system makers are under immense pressure in all over the world. Though the form factors are being curtailed day by day, the system designers are being assigned with amalgamating more power and features. System’s electrical and thermal characteristics are being affected adversely by this.

To integrate nirvana, the system designers must have to overcome several obstacles. Increased possibility of noise coupling is included to these. This is very likely to occur as components are in close proximity, as well as heat wastage, given that the power-handling capabilities continue to rise along with lesser footprint areas.

Luckily, power module designers resume to introduce new ideas to fulfill these challenging demands with the help of different architectural and topological design techniques those extract the utmost performance from the smallest package. Still, these innovations put the burden on the system designers in need of the perfect power module to be cautious in their option of solutions. The methods used by various power module solutions may comprehensively have an effect on total system cost, as well as primary performance parameters such as heat dissipation, transient response, ripple voltage, and even ease of use. It’s a great instance of ‘buyer beware’.

Modular versus Discrete case

For system designers, there are many causes to choose for a power module against designing a power converter from the component level, not least of which are ease of use and time-to-market. By attaching input and output capacitors only, these power customers can finish their designs comparatively simply and rapidly, with confidence that their primary performance and space necessities have been met. The power module is a total power converter system in an encapsulated combination that comprehends a PWM controller, simultaneous switching MOSFETs, inductors and passive components.

Young & New Century LLC, located in Houston, TX specializes in selling electronic components that are outdated, hard-to-find or might take a long time to receive. We have a large variety of electronic components available, including but not limited to integrated circuits, connectors, switches, power transistor modules, transistors and capacitors. All of our products come with 30 days of warranty period. Because of having connections with power transistor module manufacturers, OEMs and distributors, we can supply our customer’s required parts at the lowest prices along with maintaining the quality of these. Our inventory is carefully managed and held to the highest standards, and stored in a controlled environment warehousing facility. If you need a quote or any technical information, then please send us an email to sales@uscomponent.com or visit our official website http://www.uscomponent.com.

Sunday, November 5, 2017

Fuji IGBT in CNC Machines

Numerical control (NC) is the mechanization of machine tools that are functioned by accurately programmed commands encoded on a storage mean, as against to run manually via hand wheels or levers, or mechanically automated via cams alone. Most NCs today are computer numerical control (CNC), in which computers play an integral part of the control.

Fuji Electric delivers high-performance power semiconductors for energy, automotive, information technology, and industrial applications. IGBTs (Insulated Gate Bipolar Transistor) made my Fuji is used widely in CNC plasma cutters and welding machines.

Plasma cutting involves cutting a material using a plasma torch. It is commonly used to cut steel and other metals, but can be used on a variety of materials. In this process, gas (such as compressed air) is blown at high speed out of a nozzle; at the same time an electrical arc is formed through that gas from the nozzle to the surface being cut, turning some of that gas to plasma. The plasma is enough heated to melt the material being cut and moves pretty fast to blow molten metal away from the cut.

Arc and tube welding machines are mostly used in industrial setting for building and repair of the infrastructure. Welding power supplies are required to create an electric arc between an electrode and the base material to melt the metals at the welding point. The arc can be created by either DC or AC current with consumable or non-consumable electrodes. The welding region is sometimes protected by some type of inert or semi-inert gas.

Arc welding is popular due to low capital and running costs. For arc welding, the voltage is directly related to the length of the arc, and the current is related to the amount of heat input with typical currents of 50 to 500 amps depending on the size of weld. For arc welding with low voltages and large currents, a soft switching PWM DC-DC power converter with Fuji IGBT switches in the primary side of a high frequency transformer is considered to be the most suitable topology for the welding power supply110, 111. Power losses in the Fuji IGBTs are reduced by using soft switching resulting in a volume reduction of 59% and weight reduction of 47% compared with the hard-switching approach. Dynamic welding performance is improved due to operation at 40-kHz when compared with 13-kHz with hard-switching.

http://www.uscomponent.com had been selling IGBT power transistor modules since 2001. Thyssen Krupp, OTIS, IXYS, SONY DADC, General Motors, Hongkong Electric Holdings Limited, Singapore Mass Rapid Transit Trains LTD, Verkehrsbetriebe Zurich, Czech Airlines, Molex, Cisco, Omron, Good Year Tires, Thai Airasia, Boeing, Xilinx, LEAR SIEGLER, and General Electric.

http://www.uscomponent.com has a Quality Control Team like no other. This means that we know how to work hard in order to ensure to make sure that the quality of all of the parts we’re selling is high. Because we only sell new and original electronic parts, we provide our customers with a 30-day warranty. And because we have connections with IGBT power transistor modules manufacturers, OEMs and distributors, we’re able to pass any savings on to our customers, giving them a lower price while still providing them with the quality products they deserve. Our inventory is carefully managed and held to the highest standards, and stored in a controlled environment warehousing facility.

Wednesday, November 1, 2017

IGBT Converters Are Going to be Used For SBB Locos by ABB

For locomotives, which are driven by diesel or electricity, EMU and DEMU vehicles with AC Traction Motors, new microprocessor based AC-AC Traction System (MAS) offers the latest in technology combining IGBT based Traction Converter with DSP and microprocessor based embedded controls. Microprocessor based Locomotive Control system is used in conjunction with IGBT based traction converter to implement this solution.

Federal Railway of Switzerland has granted ABB Switzerland an agreement valued approximately SFr 69.2m ($US 75.4m) to provide latest traction apparatuses for its convoy of 119 Re460 electric locomotives as a section of a SFr 230m middle-life renovation program.

According to this contract, 202 IGBT traction converters will be supplied by ABB with an option for 38 additional units which are water-cooled. As per SSB’s opinion, it will be possible to reduce traction power consumption by 27GWh per year by converting the convoy to IGBT which is sufficient electricity to power 6750 homes.

Latest oil-free dual compressors will be used to equip the Re 460s. These are intended to minimize power dissipation when the locomotives are immobile. Besides this, advantages like advanced air conditioning and heating in the driver's cabs and latest fire safety systems for operation in the Gotthard Base Tunnel can be achieved by using this.

A conventional locomotive will be modernized by using IGBT converters by the end of coming year and will pass through test runs for a year before the left 118 locomotives are updated. The renovations will be executed at SBB's Yverdon-les-Bains workshop and the program is expected to be finished in 2022.

Since the early 1990s, the 200km/h four-axle Re460 has been the base of SBB's long-range convoy. As a segment of the Rail 2000 project to bring up-to-date train services and raise retention on the Swiss mainline network, the locomotives were introduced and these are built by a Swiss consortium of SLM and ABB. It is expected that this modernization program will prolong their operational life by 20 years.

http://www.uscomponent.com had been selling IGBT power transistor modules since 2001. Thyssen Krupp, OTIS, IXYS, SONY DADC, General Motors, Hongkong Electric Holdings Limited, Singapore Mass Rapid Transit Trains LTD, Verkehrsbetriebe Zurich, Czech Airlines, Molex, Cisco, Omron, Good Year Tires, Thai Airasia, Boeing, Xilinx, LEAR SIEGLER, and General Electric.

http://www.uscomponent.com has a Quality Control Team like no other. This means that we know how to work hard in order to ensure to make sure that the quality of all of the parts we’re selling is high. Because we only sell new and original electronic parts, we provide our customers with a 30-day warranty. And because we have connections with IGBT power transistor modules manufacturers, OEMs and distributors, we’re able to pass any savings on to our customers, giving them a lower price while still providing them with the quality products they deserve. Our inventory is carefully managed and held to the highest standards, and stored in a controlled environment warehousing facility.